■IBIDEN Invests for High-Performance IC Package Substrates
■UBE Invests in Immaterial (U.K)
■Mitsubishi Electric and Indian Institute of Technology Hyderabad Sign MOU to Strengthen Industry-Academia Collaboration
■Konica Minolta Collaborates with Swiss Public Research Institute iPrint to Expand Applications of Inkjet Technology
■AIST Group Establishes “Honda R&D?AIST Diamond × Electronics Collaborative Research Laboratory” with Honda R&D and AIST
■Murata Manufacturing's Production Subsidiary Fukui Murata Manufacturing Completes Ceramic Capacitor R&D Center
■NEG officially adopted for the new glass dome tweeter released by SEAS
■Stanley Electric acquires all shares of Iwasaki Electric to make it a consolidated subsidiary
■Ricoh and Ricoh Japan Sign Agreement with Saitama City on Demonstration Project for CO2 Sensors Equipped with Perovskite Solar Cells
■NHK Succeeds in Developing World's First Blue-OLED that also Generates Power
■UBE and Tohoku University Establish the Co-creation Research Institute for Future Driven Technologies
■Canon achieves world first with novel inkjet-based wafer planarization, delivering dramatically smoother wafer surfaces
■Nikon Begins Construction of a New Building at Tochigi Nikon
■Tokyo Metropolitan Bureau of Transportation Launches Pilot Program Introducing AI-Powered Transparent Translation Displays on Toei Buses