■Kaneka Begins Outdoor Demonstration Project of Tandem Perovskite Solar Cells with Saitama City
■Shimadzu invests JPY 1 billion in Kyoto University Innovation Capital's Fund �V
■Toray Research Center Shortens Evaluation Process for Insulating Films for Advanced Semiconductors by Eliminating the Need to Fabricate Test Devices
■Mitsubishi Electric Invests in Elephantech Under New Partnership
■Seiko Epson Begins Collaboration with Manz Asia, a Semiconductor Panel-Level Packaging Equipment Manufacturer
■Panasonic Industry Invests for a New MEGTRON Circuit Board Materials Production Line
■SCREEN PE launches Repair Systems for PCB
■Dexerials Partners with Plug and Play Japan
■ROHM and Suchi Semicon Enter Strategic Partnership for Semiconductor Manufacturing in India
■Seiko Epson Completes Investment in Rapidus
■Doshisha University and Shimadzu Conclude Comprehensive Education and Research Collaboration Agreement
■IBIDEN Invests for High-Performance IC Package Substrates
■UBE Invests in Immaterial (U.K)
■Mitsubishi Electric and Indian Institute of Technology Hyderabad Sign MOU to Strengthen Industry-Academia Collaboration
■Konica Minolta Collaborates with Swiss Public Research Institute iPrint to Expand Applications of Inkjet Technology
■AIST Group Establishes “Honda R&D?AIST Diamond × Electronics Collaborative Research Laboratory” with Honda R&D and AIST