■SCREEN MIRAI Laboratory Established at Osaka University Graduate School of Engineering
■Aoi Electronics and Sharp agreed to promote the construction of a production line for semiconductor back-end processes
■SCREEN Launches New Coater/developers for Forming Black PDL of OLED Backplanes
■Fujifilm Announces Completion of a New Factory for Advanced Semiconductor Materials in Korea
■DNP Commences Operation of Metal Mask Production Line for OLED Manufacturing at Kurosaki Plant
■SCREEN Launches Ledia Qs Direct Imaging System for Package Boards
■Canon releases FPD exposure equipment for dashboard displays and smartphones
■DNP exhibits at SID Display Week 2024
■Fujifilm Launches Nanoimprint Resist Compatible with Nanoimprint Lithography
■Advantest & Toray Engineering Establish Technical Partnership in Micro LED Manufacturing
■Resonac Increases Capacity to Produce Materials for AI Chips
■Dexerials operates Dexerials Photonics Solutions Corporation as integrated company leading growth in the photonics domain
■DIC Develops Basic Technology for an Innovative Epoxy Resin Curing Agent