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FPD/PCB NEWS`April 22


Mitsui Kinzoku Begins Mass Production of an Extremely-Thin Electrodeposited Cu Foil with Carrier for 5G and IoT Devices

Mitsui Mining & Smelting announced that it has started mass producing and shipping its latest MT-GN, an extremely-thin electrodeposited copper foil with carrier MicroThin.

The newly developed MT-GN is a lower roughness copper foil that reduces the nodular size to about 1/3 of our flagship MT-FL, and achieve the same adhesion to the resin substrate as MT-FL.

FPD/PCB NEWS`April 6


DENSO and Tokyo Tech Establish DENSO Mobility Collaborative Research Cluster

DENSO announced that it established the DENSO Mobility Collaborative Research Center, jointly with Tokyo Institute of Technology (Tokyo Tech) under the university's industry liaison program. The Collaborative Research Cluster will promote joint research with the support of Tokyo Tech's Open Innovation Platform from research planning to commercialization.

Specifically, the Collaborative Research Cluster will have, on the Ookayama campus of Tokyo Tech, a dedicated space to conduct applied research on heat dissipation technology for automotive components, as well as explore themes in new research together with researchers in different fields of specialization including electronics, semiconductors, electricity, mechanics, and communication to promote joint research with them. Moreover, the Collaborative Research Cluster will be staffed by people from DENSO and Tokyo Tech to promote implementing research in society, and open innovation in cooperation with other companies.

FPD/PCB NEWS`April 1


JDI transfers of fixed assets at the Hakusan plant

Japan Display (JDI) announced that it has resolved at its meeting of the board of directors held to transfer part of the equipment located at its Hakusan Plant and entered into a definitive agreement with the transferee regarding the transfer.