COF and TAB process flow and our product

COF process flow
Stella product
TAB process flow

Device structure

 

Device structure




‡@Draw up CAD data

‡@Draw up CAD data

‡AEtch Cu film by half


 
‡APunch



‡BCoat a photo-resist or laminate DFR


 
‡BLaminate copper foil

‡CExpose by UV light




©
Measure and inspect after exposure

Measuring • AOI inspection system gST seriesh

‡CCoat a photo-resist or laminate DFR


‡DDevelop photo-resist film



©
Measure and inspect after development

Measuring • AOI inspection system gST seriesh

Measure and inspect after exposure¨
Measuring • AOI inspection system gST seriesh


‡DExpose by UV light



‡EWet-etch Cu film


©Measure and inspect after etching
Measuring • AOI inspection system gST seriesh

Measure and inspect after development¨
Measuring • AOI inspection system gST seriesh


‡EDevelop photo-resist film


‡FStrip photo-resist film



©Measure and inspect after stripping
Measuring • AOI inspection system gST seriesh

Measure and inspect after etching¨
Measuring • AOI inspection system gST seriesh


‡FWet-etch Cu film
  Measure and inspect after stripping¨
Measuring • AOI inspection system gST seriesh

‡GStrip photo-resist film


Stella Corporation Co., Ltd.
1-1544-7 Kaijincho Minami, Funabashi, Chiba, Japan Zip: 273-0024
Tel: +81-(0)47-432-5031
Fax: +81-(0)47-432-5032
e-Mail support@stellacorp.co.jp
https://www.stellacorp.co.jp