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The Total Solution Exhibition for Electronic Equipment 2025 (June 4 - 6)


The Total Solution Exhibition for Electronic Equipment 2025
1μm line is patterned by mask-less exposure system


Pic.1 Cu wiring sample on some films

June 4 - 6th, The Total Solution Exhibition for Electronic Equipment 2025 was held in Tokyo Big Sight. Main topics of display category are picked up.


　 As regards wiring manufacturing process, Nippon Chemical Industrial proposed a CuO2 paste "CURELIGHT" for photo sintering. Its main component is CU2O diameter 100 - 200nm. This paste is printed on substrates by various printing methods, and then, dried at 80℃ due to volatilization of organic solvent. The next, it's reduced to Cu film by irradiation of white light from Xe lamp. Its light sintering time is mere 1 - 3msec. Thermal damage does not occur because of local heating. For this reason, not only polyimide film, but also low thermal resistance substrate such as PET and papers can be adopted. By the way, specific resistance is 20μΩ･cm, which is approximate 10 times than that of bulk.

It's possible to print fine line same as 25μm by various printing methods such as screen printing, gravure printing, and flexo printing. In the booth, various printed samples on various substrates were exhibited. It's useful for FPC, touch-panel, electromagnetic shielding, HF/UHF antenna and so on. By the way, it's impossible to print by the ink-jet printing method because of danger of nozzle clogging.


Pic.2 Patterned glass coa substrate by irradiation of CO2 laser
Large size glass core substrate appears as next generation semiconductor package substrate

Nippon Electric Glass exhibited 515×510mm TGV (Through Glass Vias) glass core substrates as a next generation semiconductor package substrate. One is patterned glass by laser reforming and etching treatment. Another is patterned glass by irradiation of CO2 laser. Substrate's thickness is 0.4mm or 0.5mm. Fine via hole same as 50 - 90 μm diameter can be formed. By the way, a bare glass substrate without TGV is prepared. The company will mass-produce at 2028.

Ultra-fine line same as 1μm is obtained by mask-less exposure

As concerns manufacturing system, Ork Manufacturing appealed mask-less exposure system, which was possible to pattern 1μm class line, and then, to pattern Line=1.2μm in spite of using dry film resist (DFR) as result of NEDO (New Energy and Industrial Technology Development Organization) project.


Pic.3 Image model of direct exposure system
Concretely, DFR (1μm thickness) is laminated on the substrate, and then, exposed by the mask-less exposure system based on laser direct imaging process. The next, a sulfation Cu enchant is plated, and then, DFR is stripped. Finally, Cu film is quickly etched. As a result, ultra-fine Cu pattern is obtained. Line width of after exposure, plating and stripping, and quick etching are 1.2μm, 3.2μm and 2.5μm repetitively.

Perfection of Micro-LED with gravure off-set printed solder paste is enhanced

Seria Corporation appealed gravure off-set printing machine greatly.


Pic.5 Green Micro-LED

Pic.4 Fine printed sample
Exhibit content is almost same as that of "39th NEPCON JAPAN", which was held at January. However, about fine printing technology, printing resolution of Cu line was increased from L&S=10μm/12μm to L&S=7μm/12μm in this time.

On the other hand, about dot printing of solder paste, a solder paste is printed on 18μm dots in TFT substrate, and then, commercial LED chips are directly mounted on dots by the laser lift-off method, as a result, green Micro-LED was pilot-produced. Perfection of this sample device was enhanced such as great increase of normal turn-on area.

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